The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Sep. 01, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kazuya Hokazono, Tokyo, JP;

Akihisa Yamamoto, Tokyo, JP;

Dong Wang, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); G06K 19/07 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G06K 19/0722 (2013.01); H01L 22/14 (2013.01); H01L 2223/5444 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device employs at least one of semiconductor chip groups. The semiconductor device includes a semiconductor chip included in the semiconductor chip groups, and a package. The semiconductor chip includes an information recording region on which is recorded a first piece of identification information indicating to which group of the semiconductor chip groups the semiconductor chip belongs based on a first category. The information recording region includes a plurality of fuses selectively blown in accordance with the first piece of identification information. Indicated on the package is a second piece of identification information indicating to which group of the semiconductor chip groups the semiconductor chip belongs based on a second category. The first and second pieces of identification information are combined together to identify the semiconductor chip from among the semiconductor chip groups.


Find Patent Forward Citations

Loading…