The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Jun. 13, 2016
Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Young Seok Kim, Hyeonggi-do, KR;

Hyun Woo Noh, Seoul, KR;

Kyoung Kook Hong, Gyeonggi-do, KR;

Su Bin Kang, Yongin-si, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/492 (2013.01); H01L 23/49537 (2013.01); H01L 24/33 (2013.01); H01L 23/367 (2013.01); H01L 23/49541 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/17747 (2013.01);
Abstract

A power module capable of increasing structural stability and reliability at high temperatures includes: an upper substrate having a metal layer; a lower substrate spaced apart from the upper substrate and having a metal layer facing the metal layer of the upper substrate; a semiconductor element configured to be disposed between the upper substrate and the lower substrate; and at least one leg portion formed on at least one of the metal layer of the upper substrate and the metal layer of the lower substrate to make the upper substrate and the lower substrate be spaced apart from each other at a predetermined interval, in which the leg portion may be electrically connect the semiconductor element to the metal layer of the upper substrate or the metal layer of the lower substrate.


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