The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
May. 24, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/12 (2013.01); H01L 21/4846 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H05K 1/181 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/131 (2013.01); H01L 2224/134 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81447 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/151 (2013.01); H01L 2924/15787 (2013.01);
Abstract
A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.