The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Dec. 11, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Yongkong Siew, Suwon-si, KR;
Seongho Park, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Methods of fabricating a semiconductor device include forming a lower interlayer insulating layer and a conductive base structure, and forming a middle interlayer insulating layer covering the lower interlayer insulating layer and the conductive base structure. The methods include etching the middle interlayer insulating layer to form a via hole and an interconnection trench vertically aligned with the via hole, and forming a via barrier layer on inner walls of the via hole and an interconnection barrier layer on inner walls and a bottom of the interconnection trench, the via barrier layer not being formed on an upper surface of the conductive base structure The methods include forming a via plug on the via barrier layer to fill the via hole, forming a seed layer on the interconnection trench and the via plug, forming an interconnection electrode on the seed layer, and forming an interconnection capping layer on the interconnection electrode.