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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10062553 B1

PDFFull Text
Date of Patent:
Aug. 28, 2018

Filed:

Jan. 31, 2017

Sputtering apparatus and processing apparatus

Applicant:

Canon Anelva Corporation, Kawasaki-shi, Kanagawa, JP;

Inventors:

Taichi Hiromi, Tokyo, JP;

Hidetoshi Shimokawa, Tokyo, JP;

Atsuyuki Ichikawa, Tokyo, JP;

Assignee:

Canon Anelva Corporation, Kawasaki-shi, Kanagawa-ken, JP;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Jason Berman

Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); G01L 21/00 (2006.01); H01L 21/203 (2006.01); H01L 21/285 (2006.01); C23C 14/56 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3447 (2013.01); C23C 14/564 (2013.01); C23C 16/4401 (2013.01); G01L 21/00 (2013.01); H01J 37/32816 (2013.01); H01J 37/32935 (2013.01); H01J 37/3411 (2013.01); H01J 37/3441 (2013.01); H01J 37/3476 (2013.01); H01L 21/203 (2013.01); H01L 21/285 (2013.01); H01J 2237/026 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/3322 (2013.01); H01L 21/2855 (2013.01);
Abstract

A sputtering apparatus includes a space defining member defining a sputtering space for forming a film on a substrate. The space defining member includes a concave portion, and an opening portion is provided in the bottom portion of the concave portion. The sputtering apparatus includes a shield member configured to shield the opening portion from the sputtering space. The opening portion is formed so that a pressure gauge capable of measuring the pressure in the sputtering space can be attached, and the shield member is arranged so that at least a part of the shield member is buried in the concave portion.

Find Patent Forward Citations

Hiromi, Taichi. (2018). Sputtering apparatus and processing apparatus (U.S. Patent No. 10062553). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10062553

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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