The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Nov. 23, 2016
Applicant:

Sonics, Inc., Milpitas, CA (US);

Inventors:

Drew E. Wingard, Palo Alto, CA (US);

Chien-Chun Chou, Saratoga, CA (US);

Stephen W. Hamilton, Pembroke Pines, FL (US);

Ian Andrew Swarbrick, Santa Clara, CA (US);

Vida Vakilotojar, Mountain View, CA (US);

Assignee:

Sonics, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G06F 12/06 (2006.01); G06F 15/173 (2006.01);
U.S. Cl.
CPC ...
G11C 7/1072 (2013.01); G06F 12/0607 (2013.01); G06F 15/17375 (2013.01); Y02D 10/13 (2018.01);
Abstract

An interconnect for an integrated circuit communicating transactions between initiator Intellectual Property (IP) cores and multiple target IP cores coupled to the interconnect is generally described. The interconnect routes the transactions between the target IP cores and initiator IP cores in the integrated circuit. A first aggregate target of the target IP cores includes two or more memory channels that are interleaved in an address space for the first aggregate target in the address map. Each memory channel is divided up in defined memory interleave segments and then interleaved with memory interleave segments from other memory channels. An address map is divided up into two or more regions. Each interleaved memory interleave segment is assigned to at least one of those regions and populates the address space for that region, and parameters associated with the regions and memory interleave segments are configurable.


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