The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Dec. 04, 2017
Applicants:

Hironori Araki, Milpitas, CA (US);

Yoshitaka Sasaki, Los Gatos, CA (US);

Hiroyuki Ito, Milpitas, CA (US);

Shigeki Tanemura, Milpitas, CA (US);

Seiichiro Tomita, Milpitas, CA (US);

Masakazu Okada, Milpitas, CA (US);

Inventors:

Hironori Araki, Milpitas, CA (US);

Yoshitaka Sasaki, Los Gatos, CA (US);

Hiroyuki Ito, Milpitas, CA (US);

Shigeki Tanemura, Milpitas, CA (US);

Seiichiro Tomita, Milpitas, CA (US);

Masakazu Okada, Milpitas, CA (US);

Assignee:

HEADWAY TECHNOLOGIES, INC., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 7/135 (2012.01); G11B 5/60 (2006.01); G11B 5/31 (2006.01); H01P 3/16 (2006.01); G11B 5/127 (2006.01); H01P 1/17 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/6088 (2013.01); G11B 5/1278 (2013.01); G11B 5/3116 (2013.01); H01P 1/174 (2013.01); H01P 3/16 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A manufacturing method for a waveguide includes forming a core including a first layer and a second layer. The first layer has a top surface including a first region with which a bottom surface of the second layer is in contact, and a second region with which the bottom surface of the second layer is not in contact. Forming the core includes the steps of: forming an initial first layer; forming an etching stopper layer on the second region of the initial first layer; forming an initial second layer on the initial first layer and the etching stopper layer; etching the initial second layer and the initial first layer so as to make the initial first layer into the first layer; and etching the initial second layer until the etching stopper layer is exposed, so as to make the initial second layer into the second layer.


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