The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
May. 17, 2016
Applicant:
J-metrics Technology Co., Ltd., Taipei, TW;
Inventors:
Wei-Ting Lin, Taipei, TW;
Shih-Chun Kuo, Taipei, TW;
Assignee:
J-METRICS TECHNOLOGY CO., LTD., Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 23/60 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); G06K 9/00013 (2013.01); H01L 23/60 (2013.01); H01L 24/73 (2013.01); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15158 (2013.01);
Abstract
A fingerprint sensing unit includes a carrier substrate, a fingerprint sensing chip on an upper surface of the carrier substrate, a molding layer, a light-pervious cover layer on the molding layer, and an adhesive layer between the light-pervious cover layer and the molding layer. The fingerprint sensing chip is electrically connected to the carrier substrate. The molding layer covers the fingerprint sensing chip.