The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Mar. 19, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Albrecht Mayer, Deisenhofen, DE;

Joerg Schepers, Rottach-Egern, DE;

Frank Hellwig, Wunstorf, DE;

Assignee:

Ifineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/38 (2006.01); G06F 13/364 (2006.01); G06F 13/40 (2006.01); G06F 13/24 (2006.01); G06F 15/78 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 13/364 (2013.01); G06F 13/24 (2013.01); G06F 13/404 (2013.01); G06F 13/4282 (2013.01); G06F 15/7807 (2013.01);
Abstract

A system for a multiple chip architecture that enables different system on-chip (SoC) systems with varying compatibilities to interact as one SoC via a transparent interface. The system address maps of the single SoCs are configured so that each provide a system address map of the two SoCs without overlap or address re-mapping when connected to one another via the transparent interface. The transparent interface enables components related to safety/security and interrupt communication of a first and second SoC within the multiple chip system to transparently communicate and interact. The transparent interface can enable sources of both SoCs to be flexibly mapped to interrupt services providers on the first/second SoC within the multiple chip system.


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