The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Oct. 14, 2016
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Michael A. Carralero, Chicago, IL (US);

Eric Y. Chan, Chicago, IL (US);

Dennis G. Koshinz, Chicago, IL (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/122 (2006.01); G02B 6/24 (2006.01); G01D 11/24 (2006.01); G01D 5/26 (2006.01); G02B 6/30 (2006.01); G02B 6/36 (2006.01); G01F 23/292 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4248 (2013.01); G01D 5/268 (2013.01); G01D 11/245 (2013.01); G02B 6/1225 (2013.01); G02B 6/241 (2013.01); G02B 6/30 (2013.01); G02B 6/366 (2013.01); G02B 6/424 (2013.01); G02B 6/4238 (2013.01); G02B 6/4253 (2013.01); G02B 6/4277 (2013.01); G01F 23/292 (2013.01); G02B 6/3624 (2013.01); G02B 6/4225 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A method, system, and apparatus are disclosed for a ruggedized photonic crystal (PC) sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for a photonic crystal sensor that includes of a hermetic-seal high-temperature jacket and a ferrule that eliminate the exposure of the optical fiber as well as the critical part of the photonic crystal sensor to harsh environments. The disclosed packaging methods enable photonic crystal based sensors to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies.


Find Patent Forward Citations

Loading…