The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Feb. 05, 2013
Applicant:

Ion Geophysical Corporation, Houston, TX (US);

Inventors:

Gregg S. Hofland, Parker, CO (US);

Jacques P. Leveille, Houston, TX (US);

Daniel S. Kahn, Houston, TX (US);

Kees Faber, Voorhout, NL;

Rick Laroo, Lisse, NL;

Jerry L. Lawson, Cypress, TX (US);

William A. Balla, Houston, TX (US);

Michael J. Saur, Houston, TX (US);

Assignee:

ION Geophysical Corporation, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 1/00 (2006.01); G01V 1/28 (2006.01); G01V 1/30 (2006.01); G01V 1/42 (2006.01); G01V 1/40 (2006.01);
U.S. Cl.
CPC ...
G01V 1/288 (2013.01); G01V 1/306 (2013.01); G01V 1/42 (2013.01); G01V 1/40 (2013.01); G01V 2210/123 (2013.01);
Abstract

Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.


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