The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Apr. 01, 2014
Applicants:

Shenzhen Byd Auto R&d Company Limited, Shenzhen, Guangdong, CN;

Byd Company Limited, Shenzhen, Guangdong, CN;

Inventors:

Qing Gong, Guangdong, CN;

Wei Zhou, Guangdong, CN;

Bifeng Mao, Guangdong, CN;

Weifeng Miao, Guangdong, CN;

Assignees:

Shenzhen BYD Auto R&D Company Limited, Shenzhen, Guangdong, CN;

BYD Company Limited, Shenzhen, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/40 (2006.01); H05K 3/18 (2006.01); C09D 11/322 (2014.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C01G 37/00 (2006.01); C01G 39/00 (2006.01); C01G 49/00 (2006.01); C01G 15/00 (2006.01); C09D 11/10 (2014.01); B01J 37/34 (2006.01); B01J 37/04 (2006.01); B01J 37/08 (2006.01); B01J 23/00 (2006.01); B01J 23/825 (2006.01); B01J 23/86 (2006.01); B01J 23/887 (2006.01); B01J 35/02 (2006.01); B01J 37/00 (2006.01); B01J 31/06 (2006.01);
U.S. Cl.
CPC ...
C09D 11/322 (2013.01); B01J 23/002 (2013.01); B01J 23/825 (2013.01); B01J 23/868 (2013.01); B01J 23/8874 (2013.01); B01J 23/8878 (2013.01); B01J 31/06 (2013.01); B01J 35/023 (2013.01); B01J 37/0036 (2013.01); B01J 37/04 (2013.01); B01J 37/08 (2013.01); B01J 37/349 (2013.01); C01G 15/006 (2013.01); C01G 37/006 (2013.01); C01G 39/006 (2013.01); C01G 49/009 (2013.01); C09D 11/10 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/1879 (2013.01); C23C 18/204 (2013.01); C23C 18/206 (2013.01); H05K 3/182 (2013.01); H05K 3/185 (2013.01); B01J 2523/00 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2006/60 (2013.01); C01P 2006/80 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0709 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/125 (2013.01);
Abstract

The present disclosure provides a metal compound. The metal compound is represented by a formula (I): CuABO(I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0<α<2, and 0<β<1.5. Polymer article containing the metal compound and method for preparing the polymer article as well as selective metallization of a surface of the polymer article are also provided. In addition, the present disclosure provides an ink composition and the selective metallization for a surface of the insulative substrate using the ink composition.


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