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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10059849 B1

PDFFull Text
Date of Patent:
Aug. 28, 2018

Filed:

Oct. 07, 2016

Methods of bonding using evaporation operative materials having low environmental impact

Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Ryan Hulse, Getzville, NY (US);

Diana Mercier, Detroit, MI (US);

Kane Cook, Eggertsville, NY (US);

Rajat S. Basu, East Amherst, NY (US);

Martin R. Paonessa, Niagara Falls, NY (US);

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:

Colleen D. Szuch

Primary Examiner:

Michael M Bernshteyn

Int. Cl.
CPC ...
C09D 7/00 (2018.01); C10M 171/00 (2006.01); A01N 25/02 (2006.01); A01N 25/04 (2006.01); A61K 47/06 (2006.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); A61K 31/727 (2006.01); B05D 1/28 (2006.01); B05D 1/30 (2006.01); B05D 3/00 (2006.01); C08J 3/09 (2006.01); C09D 133/00 (2006.01); C09J 5/00 (2006.01); C09J 11/06 (2006.01); C09J 183/04 (2006.01); C10M 131/04 (2006.01); C09D 7/20 (2018.01);
U.S. Cl.
CPC ...
C09D 7/001 (2013.01); A01N 25/02 (2013.01); A01N 25/04 (2013.01); A61K 31/727 (2013.01); A61K 47/06 (2013.01); B05D 1/02 (2013.01); B05D 1/18 (2013.01); B05D 1/28 (2013.01); B05D 1/30 (2013.01); B05D 3/007 (2013.01); C08J 3/093 (2013.01); C09D 7/20 (2018.01); C09D 133/00 (2013.01); C09J 5/00 (2013.01); C09J 11/06 (2013.01); C09J 183/04 (2013.01); C10M 131/04 (2013.01); C10M 171/005 (2013.01); C08J 2325/06 (2013.01); C08J 2333/00 (2013.01); C08J 2355/02 (2013.01); C08J 2369/00 (2013.01); C09J 2483/00 (2013.01); C10M 2203/1006 (2013.01); C10M 2211/022 (2013.01); C10M 2227/045 (2013.01); C10M 2229/025 (2013.01); C10N 2250/04 (2013.01);
Abstract

A method of bonding two surfaces by delivering to at least one of the surfaces an adhesive composition comprising: (a) at least one active bonding component; and (b) a carrier in an amount effective to at least partially solvate or at least partially emulsify said active bonding component, said carrier comprising monochlorotrifluoropropene, and then forming a bond between the surfaces.

Find Patent Forward Citations

Quick Actions:

Hulse, Ryan. (2018). Methods of bonding using evaporation operative materials having low environmental impact (U.S. Patent No. 10059849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10059849

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