The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Dec. 04, 2013
Applicants:

Peking University Founder Group Co., Ltd., Beijing, CN;

Beijing Founder Electronics Co., Ltd., Beijing, CN;

Inventor:

Yunhui Yao, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/145 (2006.01); B41J 2/16 (2006.01); B41J 25/00 (2006.01); B05B 15/68 (2018.01);
U.S. Cl.
CPC ...
B41J 2/145 (2013.01); B05B 15/68 (2018.02); B41J 2/16 (2013.01); B41J 25/001 (2013.01);
Abstract

The present invention provides a nozzle seamless splice mechanism and an adjustment method for the same, and belongs to a field of printing machinery technology. The nozzle seamless splice mechanism and the adjustment method for the same may solve the problems of nozzles orifices stagger, reduced printing width or blankness exposed in the middle caused by the causes such as the fabrication error, the personal error, etc with respect to the existing nozzles. The nozzle seamless splice mechanism of the present invention comprises: splice mechanism comprising: a micro-device for detecting coordinates of orifices of nozzles; a nozzle adjustment base for fixing nozzles; a nozzle bottom plate connected with said nozzle adjustment base adjustably. The nozzle seamless splice mechanism of the present invention has a low cost, high adjustment efficiency, and achieves digitized adjustment.


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