The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Sep. 17, 2015
Applicant:

Lisa Draexlmaier Gmbh, Vilsbiburg, DE;

Inventors:

Wolfgang Fischer, Dorfen, DE;

Stephanie Reisinger, Munich, DE;

Robert Magunia, Geisenhausen, DE;

Assignee:

Lisa Draexlmaier GmbH, Vilsbiburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/06 (2006.01); B32B 37/08 (2006.01); B32B 37/12 (2006.01); B29C 63/04 (2006.01); B29C 65/36 (2006.01); B29C 65/14 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29C 63/00 (2006.01); B29K 507/04 (2006.01); B29K 105/16 (2006.01);
U.S. Cl.
CPC ...
B32B 37/08 (2013.01); B29C 63/04 (2013.01); B29C 65/1435 (2013.01); B29C 65/1483 (2013.01); B29C 65/3612 (2013.01); B29C 65/3684 (2013.01); B29C 65/3696 (2013.01); B29C 65/487 (2013.01); B29C 65/4835 (2013.01); B29C 65/4845 (2013.01); B29C 66/301 (2013.01); B29C 66/81267 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); B29C 63/0065 (2013.01); B29C 63/0073 (2013.01); B29C 65/1412 (2013.01); B29C 65/1425 (2013.01); B29C 65/488 (2013.01); B29C 65/4885 (2013.01); B29C 66/723 (2013.01); B29C 66/8322 (2013.01); B29K 2105/167 (2013.01); B29K 2507/04 (2013.01); B32B 2310/0806 (2013.01); B32B 2605/003 (2013.01); Y10T 428/24628 (2015.01);
Abstract

A process for laminating a material layer to a support including: providing the support, applying the material layer to the support, a heat-activatable adhesive being applied to s side of the material layer facing the dimensionally stable support and/or to the side of the dimensionally stable support facing the material layer, pressing the flexible material layer and the dimensionally stable support together by means of a lower dimensionally stable mold half and an upper dimensionally stable mold half, irradiating the mold halves, the support and the material layer with electromagnetic radiation, in particular with microwave radiation, high-frequency radiation or induction radiation, whereby the adhesive is activated directly or indirectly.


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