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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10058923 B1

PDFFull Text
Date of Patent:
Aug. 28, 2018

Filed:

Aug. 27, 2015

Method for manufacturing electrode material and electrode material

Applicant:

Meidensha Corporation, Tokyo, JP;

Inventors:

Keita Ishikawa, Tokyo, JP;

Kaoru Kitakizaki, Saitama, JP;

Shota Hayashi, Tokyo, JP;

Assignee:

MEIDENSHA CORPORATION, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Colleen P Dunn

Assistant Examiner:

Anthony M Liang

Int. Cl.
CPC ...
B22F 3/26 (2006.01); B22F 9/04 (2006.01); B22F 3/15 (2006.01); C22C 1/08 (2006.01); C22C 9/00 (2006.01); C22C 27/04 (2006.01); C22C 1/04 (2006.01); H01H 1/02 (2006.01); B22F 7/00 (2006.01); B22F 7/06 (2006.01); C22C 27/06 (2006.01);
U.S. Cl.
CPC ...
B22F 3/26 (2013.01); B22F 3/15 (2013.01); B22F 7/008 (2013.01); B22F 7/06 (2013.01); B22F 9/04 (2013.01); C22C 1/045 (2013.01); C22C 1/0458 (2013.01); C22C 1/0475 (2013.01); C22C 1/08 (2013.01); C22C 9/00 (2013.01); C22C 27/04 (2013.01); H01H 1/0206 (2013.01); B22F 2998/10 (2013.01); C22C 27/06 (2013.01);
Abstract

What is disclosed is an electrode material including a sintered body containing a heat resistant element and Cr and being infiltrated with a highly conductive material. A powder mixture of a heat resistant element powder and a Cr powder is subjected to a provisional sintering in advance, thereby causing solid phase diffusion of the heat resistant element and Cr. After a Mo—Cr solid solution obtained by the provisional sintering is pulverized, the pulverized Mo—Cr solid solution powder is molded and sintered. A sintered body obtained by sintering is subjected to a HIP treatment. The highly conductive metal is disposed on the sintered body after the HIP treatment, and infiltrated into the sintered body by heating at a predetermined temperature. By conducting the HIP treatment, the withstand voltage capability and current-interrupting capability of the electrode material are improved.

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