The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Jul. 23, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Shinya Iijima, Hadano, JP;
Yoshikatsu Ishizuki, Yokohama, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H05K 7/00 (2006.01); H01L 23/28 (2006.01); H05K 3/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H01L 24/19 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/19105 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10984 (2013.01); Y02P 70/613 (2015.11);
Abstract
An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer.