The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
May. 23, 2014
Applicant:
Illinois Tool Works Inc., Glenview, IL (US);
Inventors:
XianBo Wang, Guangdong, CN;
Mark R. Heckenkamp, Sussex, WI (US);
Jerald J. Smith, Waukesha, WI (US);
Maxwell J. Kirby, West Allis, WI (US);
William E. Bargholtz, Jr., Palmyra, WI (US);
Michael S. Osvatic, Waukesha, WI (US);
Assignee:
Illinois Tool Works Inc., Glenview, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H01R 12/75 (2011.01); H01R 12/72 (2011.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H01R 12/728 (2013.01); H01R 12/75 (2013.01); H05K 1/09 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 3/007 (2013.01); H05K 3/325 (2013.01); H05K 3/3405 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10386 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/167 (2013.01);
Abstract
A printed circuit board provides lateral notches for receiving wire conductors in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes.