The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Mar. 18, 2015
Applicants:

Tridonic Jennersdorf Gmbh, Jennersdorf, AT;

Tridonic Gmbh & CO KG, Dornbirn, AT;

Inventors:

Florian Wimmer, Jennersdorf, AT;

Steffen Riemer, Krottendorf-Gaisfeld, AT;

Istvan Bakk, Torokbalint, HU;

Eduardo Pereira, Siebnen, CH;

John Schonberger, Reichenburg, CH;

Assignees:

TRIDONIC JENNERSDORF GMBH, Jennersdorf, AT;

TRIDONIC GMBH & CO KG, Dornbirn, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H05B 33/08 (2006.01); F21V 9/08 (2018.01); F21V 7/00 (2006.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 33/50 (2010.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05B 33/0845 (2013.01); F21V 7/00 (2013.01); F21V 9/08 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05B 33/0809 (2013.01); F21Y 2115/10 (2016.08);
Abstract

The present application relates to a LED module () for being connected to a DC power supply (), the LED module comprising a multilayer board () comprising a metal surface () and a dielectric layer () arranged thereon, at least one LED chip () arranged on the metal surface () of the multilayer board, an encapsulation layer () arranged above the at least one LED chip (), and current regulator means () arranged on the multilayer board, wherein the current regulator means () are designed to convert a DC input provided to the module () to a predefined DC output for being provided to the at least one LED chip ().


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