The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Nov. 03, 2015
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Jay Scott Salmon, Pittsburgh, PA (US);

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 1/04 (2006.01); B81C 1/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); B81C 1/00301 (2013.01); H04R 1/04 (2013.01); H04R 19/04 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/92 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01); H04R 2201/003 (2013.01); H04R 2201/029 (2013.01);
Abstract

Systems and methods for lead frame-based chip carriers for use with MEMS transducers. One embodiment provides a method for manufacturing a MEMS microphone package. In one exemplary embodiment, the method includes flip chip bonding a first plurality of I/O pads on an application specific integrated circuit to a plurality of traces on a lead frame. The method further includes removing at least one of the plurality of traces such that at least one of the first plurality of I/O pads is electrically isolated from the lead frame. The method further includes bonding the lead frame to a lid and electrically connecting, via at least one wire bond, a MEMS microphone mounted to the lid to the application specific integrated circuit using a second plurality of I/O pads of the application specific integrated circuit. The method further includes bonding a substrate to the lead frame to form an air tight volume within the lid.


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