The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Oct. 16, 2016
Alpha and Omega Semiconductor (Cayman) Ltd., Sunnyvale, CA (US);
Bum-Seok Suh, Seongnam, KR;
Zhiqiang Niu, Santa Clara, CA (US);
Wonjin Cho, Suwon-si, KR;
Son Tran, San Jose, CA (US);
James Rachana Bou, Long Beach, CA (US);
ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD., Sunnyvale, CA (US);
Abstract
A power module has a lead frame, a first power chip, a second power chip, a plurality of single in-line leads, a gate drive and protection integrated circuit (IC), a plurality of bonding wires and a molding encapsulation. The first and second power chips are attached to a top surface of the lead frame. The plurality of single in-line leads has a high voltage power lead, a low voltage power lead and a plurality of signal control leads. The low voltage power lead has a lead portion and an extension portion. The gate drive and protection IC is attached to the extension portion of the low voltage power lead. The molding encapsulation encloses the first and second power chips, the extension portion of the low voltage power lead, the gate drive and protection IC, the plurality of bonding wires and at least a majority portion of the lead frame.