The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Nov. 02, 2016
Applicant:
Japan Display Inc., Tokyo, JP;
Inventor:
Takuya Nakagawa, Tokyo, JP;
Assignee:
Japan Display Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/04 (2006.01); H01L 51/00 (2006.01); H01L 23/00 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01); G09G 3/3225 (2016.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 27/3244 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); H05K 1/0306 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 3/0029 (2013.01); H05K 3/361 (2013.01); H05K 7/02 (2013.01); G09G 3/3225 (2013.01); H01L 2224/32225 (2013.01); H01L 2227/326 (2013.01); H01L 2251/566 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1515 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10128 (2013.01);
Abstract
A manufacturing method of a display device includes locating a base member on a support substrate; and removing a part of the support substrate by preventing a first surface portion having a predetermined region in a border plane between the support substrate and the base member from being irradiated with laser light through the support substrate, whereas irradiating a second surface portion, other than the predetermined region, in the border plane between the support substrate and the base member with the laser light through the support substrate.