The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Mar. 13, 2014
Applicant:
G-smatt Co., Ltd., Pyeongtaek-si, KR;
Inventors:
Hak Ryul Shin, Busan, KR;
Ho Joon Lee, Seoul, KR;
Assignee:
G-SMATT CO., LTD., Pyeongtaek-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 21/00 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/743 (2013.01); H01L 24/83 (2013.01); H05K 3/305 (2013.01); H05K 3/321 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/29007 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/29027 (2013.01); H01L 2224/29036 (2013.01); H01L 2224/30131 (2013.01); H01L 2224/30135 (2013.01); H01L 2224/30136 (2013.01); H01L 2224/30151 (2013.01); H01L 2224/30155 (2013.01); H01L 2224/30179 (2013.01); H01L 2224/30505 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33135 (2013.01); H01L 2224/33179 (2013.01); H01L 2224/33505 (2013.01); H01L 2224/743 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83194 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83874 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/166 (2013.01); Y02P 70/613 (2015.11);
Abstract
Disclosed is a method of coating a conductive substrate with an adhesive, wherein the amounts and positions of conductive and non-conductive adhesives for bonding a plurality of circuit elements to the conductive substrate are set, thus preventing the spread of the adhesive from causing defects, including a poor aesthetic appearance, low electrical conductivity, and short circuits.