The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10056515 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 21, 2018

Filed:

May. 17, 2013
Applicant:

Saint-gobain Glass France, Courbevoie, FR;

Inventors:

Andreas Nositschka, Aachen, DE;

Pascal Remy, Uebach-Palenberg, DE;

Marc-Oliver Prast, Herzogenrath, DE;

Dirk Neumann, Herzogenrath, DE;

Harald Stoffel, Alsdorf, DE;

Assignee:

SAINT-GOBAIN GLASS FRANCE, Courbevoie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/048 (2014.01); H01L 31/18 (2006.01); B32B 17/10 (2006.01); B62D 25/06 (2006.01); B60L 8/00 (2006.01); H01L 31/073 (2012.01); H01L 31/0735 (2012.01); H01L 31/0749 (2012.01); H01L 51/44 (2006.01); B62D 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 31/048 (2013.01); B32B 17/10018 (2013.01); B32B 17/1077 (2013.01); B32B 17/10761 (2013.01); B32B 17/10788 (2013.01); B32B 17/10871 (2013.01); B32B 17/10889 (2013.01); B60L 8/003 (2013.01); B62D 25/06 (2013.01); B62D 29/043 (2013.01); H01L 31/0488 (2013.01); H01L 31/073 (2013.01); H01L 31/0735 (2013.01); H01L 31/0749 (2013.01); H01L 31/18 (2013.01); H01L 51/448 (2013.01); B32B 2327/12 (2013.01); B32B 2333/12 (2013.01); B32B 2369/00 (2013.01); Y02B 10/12 (2013.01); Y02E 10/50 (2013.01); Y02T 10/90 (2013.01);
Abstract

A roof panel having an integrated photovoltaic module is described. The roof panel has at least a substrate and an outer panel, which are laminarily bonded to each other by means of a thermoplastic layer, wherein a photovoltaic layer system is embedded in the thermoplastic layer and the substrate contains at least one polymer.


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