The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Aug. 01, 2016
Applicant:

Japan Display Inc., Tokyo, JP;

Inventors:

Mitsuhide Miyamoto, Tokyo, JP;

Tomoki Nakamura, Tokyo, JP;

Assignee:

JAPAN DISPLAY INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H05K 1/14 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/323 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H05K 1/147 (2013.01); H05K 3/323 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A stacked body including an organic film stacked on and in contact with an inorganic substrate, a wiring pattern, a first resin layer, a light-emitting element layer, and a second resin layer is prepared. The inorganic substrate is detached from the organic film. The stacked body from which the inorganic substrate is detached, an anisotropic conductive layer containing conductive particles having a diameter larger than the thickness of the organic film, and a wiring terminal of a flexible wiring board are disposed on top one another. The stacked body, the anisotropic conductive layer, and the flexible wiring board disposed are thermocompression bonded to cause the conductive particles to enter the organic film, and the wiring pattern and the wiring terminal are electrically connected by means of the conductive particles.


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