The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Nov. 16, 2017
Applicant:

Lapis Semiconductor Co., Ltd., Kanagawa, JP;

Inventor:

Hiroki Kasai, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/146 (2006.01); H01L 23/535 (2006.01); H01L 31/02 (2006.01); H01L 23/48 (2006.01); H01L 21/74 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14658 (2013.01); H01L 21/743 (2013.01); H01L 23/481 (2013.01); H01L 23/535 (2013.01); H01L 27/1203 (2013.01); H01L 27/1463 (2013.01); H01L 27/14612 (2013.01); H01L 27/14636 (2013.01); H01L 27/14689 (2013.01); H01L 31/02005 (2013.01); H01L 27/14676 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes an SOI substrate formed of a first semiconductor layer having a first conductive type, an embedded oxide film, and a circuit layer; and an interlayer insulation film formed on the SOI substrate. The SOI substrate has a circuit element region and an outer circumferential region surrounding the circuit element region. The circuit layer includes a plurality of single pixel circuits arranged in an array pattern. The single pixel circuit includes a circuit element, a diode, and a conductive portion. The diode includes a first region formed on the first semiconductor layer and a first conductive member formed on the interlayer insulation film and electrically connected to the first region. The conductive portion is electrically isolated from other elements. The conductive portion includes a second region formed on the first semiconductor layer and an electrode formed on the interlayer insulation film.


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