The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Aug. 31, 2016
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Hiroshi Sunamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1203 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/1225 (2013.01); H01L 29/7869 (2013.01);
Abstract

In the case where a signal delay is found in a circuit operation in a semiconductor chip, when a repeater for delay reduction is additionally formed as a result of a design change, an increase in the area of the semiconductor chip and an increase in the manufacturing cost of a semiconductor device are prevented. The inverter forming the repeater is formed of transistors formed in the upper portion of stacked wiring layers, not transistors in the vicinity of a main surface of a semiconductor substrate. By thus implementing a design change such that the repeater is added, the number of the wiring layers which need a layout change is reduced.


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