The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Mar. 03, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Fumie Kikushima, Yokkaichi, JP;

Keisuke Kikutani, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11551 (2017.01); H01L 27/11556 (2017.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/28 (2006.01); H01L 21/768 (2006.01); H01L 27/11578 (2017.01); H01L 27/11514 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11556 (2013.01); H01L 21/28273 (2013.01); H01L 21/31111 (2013.01); H01L 21/32133 (2013.01); H01L 21/76877 (2013.01); H01L 27/11514 (2013.01); H01L 27/11551 (2013.01); H01L 27/11578 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a semiconductor substrate, a stacked body, and a first insulating film. The stacked body is provided on the semiconductor substrate. The stacked body includes first films, and second films being conductive. The first films and the second films are stacked alternately. The first insulating film extends in a stacking direction of the stacked body. The second films include a first portion and a second portion. The first portion is positioned between the first films. The second portion has a surface contacting the first insulating film in a direction perpendicular to the stacking direction.


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