The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Oct. 18, 2016
Applicant:
Marvell World Trade Ltd., St. Michael, BB;
Inventors:
Runzi Chang, San Jose, CA (US);
Winston Lee, Palo Alto, CA (US);
Assignee:
Marvell World Trade Ltd., St. Michael, BB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 21/28 (2006.01); H01L 21/322 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 25/00 (2006.01); H01L 27/108 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/28185 (2013.01); H01L 21/3221 (2013.01); H01L 21/565 (2013.01); H01L 21/67017 (2013.01); H01L 21/67109 (2013.01); H01L 21/67126 (2013.01); H01L 25/50 (2013.01); H01L 27/10873 (2013.01); H01L 21/568 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/37001 (2013.01);
Abstract
The present disclosure includes systems and techniques relating to methods and systems that improve yield in multiple chips integration processes. In some implementations, a method includes providing, in a chamber, a first integrated circuit chip and a second integrated circuit chip supported on a carrier, flowing a molding compound to cover the first integrated circuit chip, the second integrated circuit chip, and the carrier; and flowing a forming gas into the chamber while curing the molding compound.