The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Feb. 20, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Martin Eckert, Moetzingen, DE;

Otto Torreiter, Leinfelden-Echterdingen, DE;

Quintino L. Trianni, Böblingen, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01); H01L 21/48 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/4853 (2013.01); H01L 21/67144 (2013.01); H01L 24/81 (2013.01); G01R 1/0466 (2013.01); G01R 1/0483 (2013.01); H01L 2224/759 (2013.01); H01L 2224/75316 (2013.01); H01L 2224/75756 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81908 (2013.01);
Abstract

A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.


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