logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10056311 B1

PDFFull Text
Date of Patent:
Aug. 21, 2018

Filed:

Jul. 20, 2017

Electronic circuit module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Kyoto, JP;

Muneyoshi Yamamoto, Kyoto, JP;

Norio Sakai, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Sheikh Maruf

Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/14 (2006.01); H05K 1/18 (2006.01); H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 29/41 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/14 (2013.01); H01L 23/28 (2013.01); H01L 23/481 (2013.01); H01L 23/49572 (2013.01); H01L 23/49827 (2013.01); H01L 23/52 (2013.01); H01L 29/41 (2013.01); H05K 1/188 (2013.01);
Abstract

An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

Find Patent Forward Citations

Loading…