The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Aug. 26, 2017
Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventor:

Tohru Kawai, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 27/06 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823418 (2013.01); H01L 21/823481 (2013.01); H01L 21/823814 (2013.01); H01L 21/823835 (2013.01); H01L 27/0629 (2013.01); H01L 29/456 (2013.01);
Abstract

A manufacturing method of a semiconductor device comprises a step of ion-implanting a P-type impurity at a first dose amount to form semiconductor regions that are low concentration semiconductor regions of a high breakdown voltage P-type transistor, and a step of ion-implanting a P-type impurity at a second dose amount to form Psemiconductor regions that are low concentration semiconductor regions of a low breakdown voltage P-type transistor and form a P-type impurity layer that is a resistance portion of a polysilicon resistor. The manufacturing method further comprises a resistance portion forming step in which a resistance portion of the polysilicon resistor is made thinner than terminal portions at both ends of the resistance portion, and the second dose amount is larger than the first dose amount.


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