The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Feb. 05, 2016
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Hiroki Manabe, Tokyo, JP;

Hiroyuki Sakakibara, Tokyo, JP;

Masahiro Minamide, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 7/282 (2006.01); H01B 7/04 (2006.01); B32B 15/04 (2006.01); B32B 1/08 (2006.01); B32B 3/30 (2006.01); B32B 15/08 (2006.01); H01B 7/14 (2006.01); H01B 7/28 (2006.01); B32B 15/082 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); B32B 25/18 (2006.01); B32B 25/20 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 3/18 (2006.01);
U.S. Cl.
CPC ...
H01B 7/2825 (2013.01); B32B 1/08 (2013.01); B32B 3/30 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); H01B 7/045 (2013.01); H01B 7/14 (2013.01); H01B 7/282 (2013.01); H01B 7/2806 (2013.01); B32B 3/18 (2013.01); B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 25/08 (2013.01); B32B 25/18 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2307/206 (2013.01); B32B 2307/54 (2013.01); B32B 2307/544 (2013.01); B32B 2307/546 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); B32B 2597/00 (2013.01); B32B 2605/16 (2013.01); Y02A 30/14 (2018.01);
Abstract

Protrusion portions and recess portions are formed on a metal layer. The protrusion portions are repeatedly formed in a lattice shape at a pitch of P. Similarly, the recess portions are repeatedly formed in the lattice shape at the pitch of P. The protrusion portions and the recess portions are arranged in the same arrangement direction and arranged shifted to each other by half the pitch in the arrangement direction. The protrusion portions and the recess portions are formed independently of each other without contacting each other. In order to allow a multilayer tape to reliably follow the bending deformations of a power cable (submarine cable) in all directions, in an arbitrary cross-section taken in the longitudinal direction of the multilayer tape (in the axial direction of an impermeable layer), the protrusion portions or the recess portions are necessarily arranged at predetermined intervals.


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