The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Jun. 19, 2017
Applicant:

Dell Products, L.p., Round Rock, TX (US);

Inventors:

Chun-Lin Liao, Taipei, TW;

Ching Huei Chen, Pingtung, TW;

Bhyrav M. Mutnury, Austin, TX (US);

Siang Chen, Taipei, TW;

Assignee:

Dell Products, L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 5/00 (2006.01); G06F 1/16 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
G06F 1/16 (2013.01); H05K 1/0245 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01);
Abstract

A circuit board assembly of an information handling system has an adjacent pair of vias that carry differential communication signal through printed circuit board (PCB) substrates. Pairs of ground vias each having a first ground via and a second ground via placed symmetrically on both sides of a virtual ground plane that passes between the adjacent pair of vias. Ground vias are placed at a substantially identical radius from a respective one of the adjacent pair of vias that is on the same side of the virtual ground plane. First ground via(s) are annularly spaced substantially equally from each other and from a pair of reference points on the virtual ground plane that are each radially spaced from both of the adjacent pair of vias by the substantially identical radius. The second ground via(s) are annularly spaced from each other and the pair of reference points.


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