The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Apr. 27, 2016
Xiamen Tianma Micro-electronics Co., Ltd., Xiamen, CN;
Tianma Micro-electronics Co., Ltd., Shenzhen, CN;
Binbin Chen, Xiamen, CN;
Xiamen Tianma Micro-electronics Co., Ltd., Xiamen, CN;
Tianma Micro-electronics Co., Ltd., Shenzhen, CN;
Abstract
An array substrate and an array substrate fabrication method are provided. The array substrate comprises a base substrate, a first conductive layer, a first passivation layer including a plurality of first through-holes. a light-shielding layer including a plurality of first metal wires arranged in parallel, a second passivation layer including a plurality of second through-holes, and a first metal layer including a plurality of second metal wires arranged in parallel and one-to-one corresponding to the plurality of first metal wires. The first metal wire is electrically connected to the first conductive layer through at least one first through-hole, and the second metal wire is electrically connected to the corresponding first metal wire through at least one second through-hole. The array substrate includes a display region and a non-display region, and the first through-holes and the second through-holes are formed at the non-display region of the array substrate.