The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
May. 04, 2016
Applicant:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Inventors:
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); F21V 8/00 (2006.01); F21V 7/10 (2006.01); F21V 23/00 (2015.01); H01L 33/50 (2010.01); H05K 1/18 (2006.01); G02F 1/1335 (2006.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
G02B 6/0031 (2013.01); F21V 7/10 (2013.01); F21V 23/005 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H05K 1/181 (2013.01); G02B 6/009 (2013.01); G02B 6/0026 (2013.01); G02B 6/0073 (2013.01); G02F 1/133615 (2013.01); H01L 33/405 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10674 (2013.01);
Abstract
A light source module including a circuit board, a first light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a reflective portion disposed on the circuit board and having at least one recess accommodating the first light emitting device, and a bonding member disposed between the circuit board and the reflective portion. The reflective portion has a height greater than a height of the first light emitting device.