The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Feb. 28, 2017
Applicant:

Aavid Thermalloy, Llc, Laconia, NH (US);

Inventors:

Morten Søegaard Espersen, Bologna, IT;

Marco Moruzzi, Bologna, IT;

Dennis N. Jensen, Bologna, IT;

Sukhvinder S. Kang, Concord, NH (US);

Assignee:

Aavid Thermalloy, LLC, Laconia, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); H01L 23/427 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
F28D 15/025 (2013.01); F28D 15/0266 (2013.01); H01L 23/427 (2013.01); H01L 23/3672 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.


Find Patent Forward Citations

Loading…