The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Nov. 26, 2013
Applicant:

Nichiban Co., Ltd., Tokyo, JP;

Inventors:

Masanori Sato, Tokyo, JP;

Hiroki Matsushita, Tokyo, JP;

Eri Moriyama, Tokyo, JP;

Assignee:

NICHIBAN CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65B 13/02 (2006.01); B65B 13/20 (2006.01); B65B 13/24 (2006.01); B65B 13/32 (2006.01); B65B 13/14 (2006.01); B65B 27/00 (2006.01); A01G 17/08 (2006.01); B65B 13/30 (2006.01);
U.S. Cl.
CPC ...
B65B 13/025 (2013.01); A01G 17/085 (2013.01); B65B 13/14 (2013.01); B65B 13/20 (2013.01); B65B 13/24 (2013.01); B65B 13/327 (2013.01); B65B 27/00 (2013.01); B65B 13/305 (2013.01);
Abstract

A binding apparatus includes a pressure bonding mechanism in which pressure is applied by a pair of pressure bonding plates to a joining portion of a binding tape, which is an adhesive tape, to fasten it together by gripping and squeezing a pair of levers to rotate a pair of arms around a fulcrum. Thereby, any mixing of metal staples into an object to be bound as in a conventional binding apparatus is eliminated, and thus the quality of the object to be bound can be ensured. Further, the need for a strong grip strength like that when ejecting a staple is eliminated, and thus the burden on an operator can be reduced.


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