The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Apr. 29, 2016
Applicant:

Koenig & Bauer Ag, Würzburg, DE;

Inventors:

Arndt Jentzsch, Coswig, DE;

Christian Ziegenbalg, Weinböhla, DE;

Bernd Patzelt, Meißen, DE;

Hartmut Nickell, Dresden, DE;

Martin Riese, Radebeul, DE;

Stefan Singer, Radebeul, DE;

Michael Koch, Dresden-Cossebaude, DE;

Carsten Reinsch, Radebeul, DE;

Assignee:

Koenig & Bauer AG, Wurzburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 3/54 (2006.01); B41F 23/08 (2006.01); B41J 3/407 (2006.01); B41J 11/00 (2006.01); B41J 2/04 (2006.01); B41F 19/00 (2006.01); B41M 3/00 (2006.01); B41J 13/22 (2006.01);
U.S. Cl.
CPC ...
B41J 3/546 (2013.01); B41F 19/007 (2013.01); B41F 23/08 (2013.01); B41J 2/04 (2013.01); B41J 3/407 (2013.01); B41J 11/002 (2013.01); B41J 13/226 (2013.01); B41M 3/00 (2013.01);
Abstract

A method and machine arrangement for sequential processing of sheet-like substrates are disclosed. At least one of a front side and a rear side of the substrates is processed in a production line one after another. A printing ink or another type of ink is applied in at least one non-impact printing device on the respective side of the substrates. The printing ink or the other type of ink is dried. A dispersion coating or a coating cured by UV radiation is then applied onto the respective side of the substrates. The dispersion coating or the coating cured by UV radiation is dried and the substrates are fed to a mechanical processing device for carrying out a further mechanical processing of the substrates. The further mechanical processing is performed by at least one of punching, inserting grooves, separating parts and by breaking out panels from their respective composite in the respective substrate.


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