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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10052723 B1

PDFFull Text
Date of Patent:
Aug. 21, 2018

Filed:

Sep. 13, 2016

Systems and methods for perforating materials

Applicant:

Rohr, Inc., Chula Vista, CA (US);

Inventors:

Robert L. Braden, Chula Vista, CA (US);

Vijay V. Pujar, Chula Vista, CA (US);

Sean Tiwari, Glendora, CA (US);

Teresa Kruckenberg, La Mesa, CA (US);

Assignee:

Rohr Inc., Chula Vista, CA (US);

Attorney:

Snell & Wilmer L.L.P.

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
B23K 26/382 (2014.01); B29C 59/16 (2006.01); B23K 26/402 (2014.01); B23K 26/70 (2014.01); B23B 35/00 (2006.01); B29K 105/00 (2006.01); B29L 31/00 (2006.01); B23K 101/34 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/382 (2015.10); B23B 35/00 (2013.01); B23K 26/402 (2013.01); B23K 26/703 (2015.10); B29C 59/16 (2013.01); B23B 2215/04 (2013.01); B23B 2226/27 (2013.01); B23K 2201/34 (2013.01); B23K 2203/172 (2015.10); B23K 2203/50 (2015.10); B29K 2105/251 (2013.01); B29L 2031/737 (2013.01);
Abstract

Systems and methods for manufacturing laser-perforated nanoreinforced materials are disclosed. A honeycomb core may utilize a perforated top sheet and a microperforated overlay film coupled to the perforated top sheet. The perforated top sheet and/or the microperforated film may include thermally conductive nanomaterials. The perforations in the top sheet and the microperforations in the film may be laser drilled. The nanomaterials may dissipate heat generated by the laser drilling, allowing for increased perforation speeds.

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