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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10051757 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Oct. 12, 2017

Electronic package module

Applicant:

Bothhand Enterprise Inc., Tainan, TW;

Inventors:

Yung-Ming Pan, Taoyuan, TW;

Chung-Cheng Fan, Taoyuan, TW;

Assignee:

Bothhand Enterprise Inc., Tainan, TW;

Attorney:

Michael Best & Friedrich LLP

Primary Examiner:

Hung S Bui

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/02 (2006.01); H05K 7/14 (2006.01); H01L 49/02 (2006.01); H01F 5/04 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01F 5/00 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/026 (2013.01); H01F 5/003 (2013.01); H01F 5/04 (2013.01); H01L 23/49805 (2013.01); H01L 23/528 (2013.01); H01L 27/0207 (2013.01); H01L 28/10 (2013.01); H05K 7/14 (2013.01);
Abstract

An electronic package module includes a packaging box, multiple terminals, and a coil unit. The packaging box includes a mounting wall including a base surface, multiple protruding blocks disposed on the mounting wall, and multiple gaps each being located between adjacent two of the protruding blocks. The terminals are mounted to the mounting wall, and each have a welding section received in a corresponding one of the gaps and having a welding surface and a guiding surface bent from the welding surface. The coil unit includes multiple wires each having a connecting section connected to the welding surface and an extending section bent from the connecting section and abutting against the guiding surface.

Find Patent Forward Citations

Pan, Yung-Ming. (2018). Electronic package module (U.S. Patent No. 10051757). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10051757

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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