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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10051725 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Oct. 29, 2014

Circuit board, electronic component housing package, and electronic device

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Yoshiki Kawazu, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Stephen E Jones

Assistant Examiner:

Scott S Outten

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01P 3/08 (2006.01); H05K 5/00 (2006.01); H05K 1/18 (2006.01); H01P 3/02 (2006.01); H01P 5/02 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0246 (2013.01); H01P 3/026 (2013.01); H01P 3/081 (2013.01); H01P 5/028 (2013.01); H05K 1/025 (2013.01); H05K 1/0245 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 5/0069 (2013.01); H05K 1/0253 (2013.01); H05K 1/117 (2013.01); H05K 3/3405 (2013.01); H05K 3/363 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10189 (2013.01);
Abstract

This circuit board includes a plate body made of a dielectric body and having a front surface and a back surface, a differential signal line formed on the front surface, the differential signal line being made of a pair of signal lines, and a ground conductor formed on the back surface. The signal lines include: terminals formed at a distance from the ground conductor, in an end portion at a prescribed distance from one end of the back surface; connection pads connected to the terminals and provided on the end portion of the front surface so as to be opposed to the terminals; transmission line units extending from the connections pads; and a widened portion provided in a position on the transmission line units corresponding to a space between the terminal and the ground conductor, the widened portion having a line width greater than that of the transmission line units.

Find Patent Forward Citations

Kawazu, Yoshiki. (2018). Circuit board, electronic component housing package, and electronic device (U.S. Patent No. 10051725). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10051725

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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