The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Sep. 11, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Jochen Zoellin, Muellheim, DE;

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Christoph Schelling, Stuttgart, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 19/04 (2006.01); H04R 1/04 (2006.01); H05K 1/18 (2006.01); H04R 31/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); H04R 31/00 (2013.01); H04R 31/006 (2013.01); H05K 1/0296 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H04R 2201/003 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10083 (2013.01); Y02P 70/611 (2015.11);
Abstract

Measures are described by which the back volume of a microphone component can be realized regardless of its packaging. Within the framework of a microphone module, a circuit board is used for the 2nd-level mounting of at least one microphone component part, in whose surface at least one connection opening is formed, which terminates in a cavity in the layer structure of the circuit board. In addition, the circuit board surface having the connection opening is configured for a sealing mounting of the microphone component part above the connection opening, so that the microphone component is acoustically connected to the cavity in the circuit board via the connection opening in the circuit board surface, and this cavity functions as backside volume for the microphone component part.


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