The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Jul. 18, 2016
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Hiroaki Ochiai, Kyoto, JP;

Junya Nishii, Kyoto, JP;

Tsuyoshi Nakai, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/64 (2006.01); H03H 9/02 (2006.01); H01L 41/08 (2006.01); H03H 9/15 (2006.01); H03H 9/25 (2006.01); H03H 3/02 (2006.01); H03H 9/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1092 (2013.01); H01L 41/081 (2013.01); H03H 9/02905 (2013.01); H03H 9/15 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01); H03H 9/6489 (2013.01); H03H 3/02 (2013.01); H03H 9/0038 (2013.01); H03H 9/02992 (2013.01);
Abstract

A SAW device () comprises a substrate (); SAW elements () on a first main surface () of the substrate (); first lines (intermediate lines () and output side lines ()) that are disposed upon the first main face () and connected to the SAW elements (); an insulator () that is layered upon the first lines; second lines (a second ground line () and a third ground line ()) that are layered upon the insulator () and configure three-dimensional wiring parts () with the first lines; and a cover () that seals the SAW elements () and the three-dimensional wiring parts (). Wiring spaces (), formed between the first main face () and the cover (), houses the three-dimensional wiring parts (), without housing the SAW elements ().


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