The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Nov. 13, 2015
Sts Semiconductor & Telecommunications Co., Ltd., Cheonan-si, Chungcheongnam-do, KR;
Jai Kyoung Choi, Busan, KR;
Eun Dong Kim, Seoul, KR;
Hyun Hak Jung, Cheonan-si, KR;
Hyeong Min Kim, Hoengseong-gun, KR;
Jong Hwi Jung, Cheonan-si, KR;
Su Kyung Lim, Yeongju-si, KR;
Abstract
Provided is a method of manufacturing a voice coil, and more particularly, a method of manufacturing a voice coil in which a coil pattern is formed on a wafer level package. The method includes (a) forming a first coil pattern including a first area in which a first seed metal layer is exposed upward, a second area in which a first passivation layer for forming a via hole in the first area is formed, and a third area in which a first photoresist layer is formed in a portion of the first area and the second area on an upper surface of a wafer, (b) filling an inside of the via hole formed in the first coil pattern with a conductive material and forming first coil windings, and (c) removing the first photoresist layer formed in the third area.