The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Apr. 23, 2013
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;
Inventors:
Kosuke Nakano, Nagaokakyo, JP;
Hidekiyo Takaoka, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01R 4/02 (2006.01); B23K 35/24 (2006.01); B23K 1/00 (2006.01); H01R 4/04 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B22F 1/00 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); C22C 1/04 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); B22F 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 4/02 (2013.01); B22F 1/0059 (2013.01); B22F 7/064 (2013.01); B22F 7/08 (2013.01); B23K 1/00 (2013.01); B23K 35/24 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 1/0483 (2013.01); C22C 1/0491 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01R 4/04 (2013.01); B22F 1/025 (2013.01);
Abstract
A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.