The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Jul. 08, 2015
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Robin Bonnet, Grenoble, FR;

Jean-Marc Gilet, Fontaine, FR;

Tony Maindron, Grenoble, FR;

Jean-Yves Simon, Fontaine, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/44 (2006.01); H01L 51/56 (2006.01); H01L 45/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5256 (2013.01); H01L 51/448 (2013.01); H01L 51/56 (2013.01); H01L 21/0228 (2013.01); H01L 45/08 (2013.01); H01L 45/1233 (2013.01); H01L 45/145 (2013.01); H01L 45/146 (2013.01);
Abstract

An encapsulated device comprises: an organic optoelectronic component exhibiting at least one sensitive surface protected from oxygen and/or water vapor; and a multilayer encapsulation structure covering the sensitive surface, comprising at least one layer made of organic material interposed between first and second barrier layers made of nonmetallic inorganic material impermeable to oxygen and water vapor; wherein the barrier layers are made of a material chosen from a stoichiometric metal oxide, stoichiometric silicon oxide and a silicon oxynitride and produced by atomic layer deposition, and wherein the multilayer encapsulation structure also comprises at least one active layer containing a nonstoichiometric oxide exhibiting an oxygen deficiency, also interposed between the first and said second barrier layers. A process for encapsulating a component exhibiting a 'sensitive' surface protected from oxygen and/or water vapor by producing a multilayer encapsulation structure is provided.


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