The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Aug. 10, 2011
Applicants:

Tomoya Tamura, Ibaraki, JP;

Hiroyoshi Yamamoto, Ibaraki, JP;

Masaru Sakamoto, Ibaraki, JP;

Inventors:

Tomoya Tamura, Ibaraki, JP;

Hiroyoshi Yamamoto, Ibaraki, JP;

Masaru Sakamoto, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0272 (2006.01); B22F 3/14 (2006.01); C22C 9/00 (2006.01); C22C 28/00 (2006.01); C23C 14/34 (2006.01); H01L 31/032 (2006.01); H01L 31/18 (2006.01); C22C 1/04 (2006.01); B22F 9/04 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0272 (2013.01); B22F 3/14 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); C22C 28/00 (2013.01); C23C 14/3414 (2013.01); H01L 31/0322 (2013.01); H01L 31/18 (2013.01); B22F 9/04 (2013.01); B22F 2998/10 (2013.01); Y02E 10/541 (2013.01); Y02P 70/521 (2015.11);
Abstract

A Cu—Ga alloy sintered-compact sputtering target having a Ga concentration of 40 to 50 at % and Cu as the balance, wherein the sintered-compact sputtering target is characterized in that the relative density is 80% or higher, and the compositional deviation of the Ga concentration is within ±0.5 at % of the intended composition. A method of producing a Cu—Ga alloy sintered-compact sputtering target having a Ga concentration of 40 to 50 at % and Cu as the balance, wherein the method thereof is characterized in that Cu and Ga raw materials are melted and cooled/pulverized to produce a Cu—Ga alloy raw material powder, and the obtained material powder is further hot-pressed with a retention temperature being between the melting point of the mixed raw material powder and a temperature 15° C. lower than the melting point and with a pressure of 400 kgf/cmor more applied to the sintered mixed raw material powder. Provided are a sputtering target having very low compositional deviation and high density; a method of producing the target; a light-absorbing layer having a Cu—Ga based alloy film; and a CIGS solar cell including the light-absorbing layer.


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