The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Jul. 22, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Tadahiro Hagita, Kumamoto, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1464 (2013.01); H01L 27/14629 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01);
Abstract

A device including a substrate and an imaging element layer having a plurality of imaging elements is provided, where the imaging element layer is located between the substrate and a wiring layer having a plurality of wiring lines (), and wiring lines of the wiring layer are arranged in pixel regions (Z) configured to receive light having a wavelength less than a predetermined wavelength (B, G). Accordingly, by more uniformly distributing the wiring layer throughout, it is possible to reduce an unevenness that occurs at a polishing film. Moreover, because wiring lines are not disposed in pixel regions (Z) configured to receive light having a wavelength greater than the predetermined wavelength (R), irregularities may be reduced.


Find Patent Forward Citations

Loading…