The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Nov. 03, 2016
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Ralph Wirth, Lappersdorf, DE;

Alexander Linkov, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 27/15 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 33/483 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/502 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0091 (2013.01);
Abstract

An optoelectronic component for mixing electromagnetic radiation having different wavelengths, for example, for the far field is disclosed. In an embodiment the optoelectronic component includes a carrier, at least one first semiconductor chip arranged on the carrier and having a first radiation exit surface for emitting electromagnetic radiation in a first spectral range and at least one second semiconductor chip arranged on the carrier and having a second radiation exit surface for emitting electromagnetic radiation in a second spectral range, wherein a diffusing layer is arranged on the first and second radiation exit surfaces of the semiconductor chips that face away from the carrier and wherein a reflecting layer is arranged between the first semiconductor chip and the second semiconductor chip, the first and second radiation exit surfaces being free from the reflecting layer at least in regions.


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